Signal Integrity Engineer

Engineer

Signal Integrity Engineer

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  • Date posted
    September 14, 2026
  • Expiration date
    December 14, 2026
  • Application ends
    December 14, 2026

Our Client  is immediately seeking an experienced Signal Integrity Engineer in support of our enterprise networking and cloud solutions engineer .

Key Responsibilities:

  • Perform signal integrity analysis for high-speed digital designs, including PCB, package, and interconnect structures
  • Develop and execute simulation models to evaluate signal quality, timing margins, impedance control, crosstalk, reflections, and channel performance
  • Utilize 2D/3D electromagnetic field solvers and signal integrity simulation tools to predict and optimize system performance
  • Collaborate with hardware, layout, and design engineering teams to establish routing guidelines and design best practices
  • Support the development and validation of high-speed interfaces and communication channels
  • Analyze simulation and laboratory measurement results to identify performance limitations and recommend design improvements
  • Conduct signal integrity characterization using laboratory equipment such as oscilloscopes, Time Domain Reflectometers (TDR), and Vector Network Analyzers (VNA)
  • Create technical documentation, design recommendations, and test reports to support engineering decisions
  • Participate in design reviews and provide guidance on signal integrity and power integrity considerations
Requirements
  • Bachelor’s or Master’s degree in Electrical Engineering or a related field
  • 3-5 years of relevant experience in signal integrity or hardware design
  • Knowledge of transmission line theory and high-speed circuit fundamentals, with experience using signal-integrity simulation and 2D/3D field-solver tools

Desired Skills:

  • Experience with laboratory equipment such as oscilloscopes, TDR, or VNA
  • Experience with IBIS, HSPICE, ADS, MATLAB, Cadence PowerSI AC/DC, or Allegro
  • Exposure to high-speed interfaces and links such as SerDes, LVDS, CML, DDR, NRZ, or PAM4, including high-speed PCB/package development or PI analysis
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