Senior BEOL Process Integration Engineer

Engineer

Senior BEOL Process Integration Engineer

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  • Date posted
    September 4, 2026
  • Expiration date
    December 4, 2026
  • Application ends
    December 4, 2026

We are working directly with the Hiring Manager on this search assignment.

Responsibilities:

  • Lead BEOL process integration efforts to optimize product yield and manufacturing performance
  • Will be owning and optimizing the complex, multi-step sequence used to build microscopic copper electrical interconnects on semiconductor wafers
  • Drive improvements in quality, reliability, cost, productivity, and process capability
  • Identify yield-limiting factors and implement corrective actions with cross-functional engineering teams
  • Support technology transfer and process matching with foundry partners
  • Utilize SPC, FDC, DOE, and JMP to analyze data and solve complex manufacturing challenges
Requirements
  • BS, or MS degree in Chemical Engineering, Materials Engineering or related field
  • At least 4+ years or more of semiconductor BEOL Process Integration experience
  • At least 4 years of semiconductor BEOL process integration engineering experience; Must have been in a BEOL Integration Engineer role; Will be the subject matter expert; Must be able to hit the ground running
  • Must have minimum of 5 years of being an actual process integration engineer in a Cu back-end Fab process (Back End Of Line (BEOL) manufacturing phase)
  • Must have strong work experience with the following process modules: Photo, Etch, Thin Films, and CMP
  • Seeking a process integration engineer in a copper (Cu) back-end-of-line (BEOL) fab with strong experience owning and optimizing the complex, multi-step sequence used to build microscopic copper electrical interconnects on semiconductor wafers
  • Must have strong experience looking at the entire end-to-end interconnect flow
  • Experience partnering with Process and Yield Engineering teams to improve fab performance
  • Hands-on experience with SPC, FDC, DOE, and JMP
  • Strong knowledge of Photolithography, Etch, Thin Films, and CMP processes
  • Proven background transferring technologies from R&D into high-volume manufacturing
  • Strong communication, leadership, and teamwork skills
  • Are you interested in this position?

     

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