Our Client Currently looking for Requirements Management Support Engineer

Job Responsibilities

• Gain insights into development trends in the optical communications field and build continuous competitiveness in silicon photonics technology for short-reach optical interconnects and coherent optical communications.
• Lead new concept studies and product development projects from the R&D stage through new product introduction.
• Guide the definition of complex silicon photonics chip architectures and deliver best-in-class performance for active and passive components.
• Lead optoelectronic co-design activities for modulators, detectors, drivers, and transimpedance amplifiers.
• Lead the optimisation of overall optoelectronic systems using 2.5D and 3D advanced packaging to ensure high-speed signal integrity.
• Work as part of a team of photonics engineers and product designers dedicated to developing a silicon photonics device and product portfolio.
• Collaborate closely with solution, process, and packaging teams to ensure successful implementation of the architecture and key technologies.

Requirements and Qualifications

Technical Knowledge

• In-depth knowledge of integrated optics and optoelectronic components.
• Deep understanding of silicon photonics technology trends and the ability to identify key technology directions.
• Working knowledge of integrating photonic integrated circuits with electronic integrated circuits, RF integrated circuits, and driver circuitry in transceiver modules or equivalent subsystem applications.
• Hands-on experience with photonics modelling tools such as Photon Design and Lumerical.
• Experience with Luceda IPKISS, Python, VPI software, or similar tools would be advantageous.

Education

• Ph.D. preferred in Photonics, Electrical Engineering, Physics, or a related field.
• At least five years of professional experience in the photonics industry.

Professional Experience

• Experience in the design and testing of silicon photonics, with a successful track record in product development.
• Experience defining product specifications, developing yield-improvement strategies, identifying new business opportunities, and supporting commercially focused product decisions.
• Experience in high-density optoelectronic integration using 2.5D or 3D advanced packaging.
• Experience in the co-design of optoelectronic chips is preferred.
• Proven project and product management experience, including bringing new components or systems into volume production.
• Experience communicating effectively with stakeholders to secure internal funding for new R&D projects.
• Experience conducting market and business landscape analysis.

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