We are seeking an experienced semiconductor specialist to spearhead the optimization and establishment of frontend wafer-level fabrication processes. In this position, you will drive the development of innovative manufacturing methodologies, bridge the gap between process variables and final device behavior, and lead cross-functional technical teams to scale next-generation component platforms.

Responsibilities

• Process Engineering & Innovation: Establish custom fabrication conditions to achieve exact device metrics while investigating novel manufacturing solutions using advanced technological concepts.
• Specification & Parameter Control: Identify, monitor, and govern critical process parameters to set clear manufacturing baselines and link physical fabrication steps directly to final component characteristics.
• Project & Integration Leadership: Direct multidisciplinary projects to refine process integration, establish best-known methods (BKM), and align technical outputs with target device tolerances.
• “More-than-Moore” R&D: Scout, introduce, and integrate bleeding-edge technology roadmaps and specialized process modules to support novel production lines.
• External & Academic Partnerships: Collaborate closely with external research organizations and equipment manufacturers to introduce, test, and optimize state-of-the-art wafer-level procedures.

Qualifications

• Master’s degree or PhD in Physics, Chemistry, Electrical Engineering, Microsystems Technology, Semiconductor Science, or an equivalent technical field.
• 5+ years infront-end semiconductor module processing, with a preference for backgrounds in MEMS, photonics, or optical component manufacturing fabs.
• Comprehensive command of semiconductor physics and microfabrication engineering.
• Deep practical knowledge of specific module loops, including dry/wet etching, laser direct writing, chemical vapor deposition (PECVD), and wet bench operations.
• Demonstrated capability to utilize data processing tools and evaluation frameworks to interpret parametric wafer testing, in-line metrics, and monitoring structures.
• Proven skill in driving improvements across production yield, cost efficiency, process stability, and device reliability.
• Exceptional communication and presentation capabilities in English; fluency in Chinese or German is considered an advantageous bonus.
• A proactive, adaptable mindset with demonstrated leadership qualities and a readiness to operate effectively in a diverse, international workspace.
• Flexibility to undertake occasional international travel to support joint technical ventures.

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