Front-end Wafer Process Technician

Technician

Front-end Wafer Process Technician

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  • Date posted
    July 24, 2026
  • Expiration date
    October 24, 2026
  • Application ends
    October 24, 2026

We are seeking a hands-on technical professional to manage daily manufacturing operations within our advanced cleanroom environment. In this position, you will execute core semiconductor fabrication processes, uphold strict quality benchmarks, and collaborate with internal and external specialists to deploy novel wafer-level technologies.

Responsibilities

  • Fabrication & Tool Operation: Execute routine manufacturing steps, which include operating, loading, and maintaining specialized equipment for chemical vapor deposition (CVD), photolithography, wafer cleaning, etching, metrology, and optical inspection.
  • Quality Assurance & Inspection: Conduct rigorous process monitoring and surface defect checks using precision measurement instruments and microscopes to guarantee adherence to exact production specifications.
  • Data Tracking & Troubleshooting: Monitor wafer progress through designated workflows, examine statistical process data, and promptly address equipment alerts to re-establish system stability.
  • Cleanroom Compliance: Strictly observe all ISO 5 cleanroom guidelines and environmental safety protocols.
  • Collaborative R&D: Work alongside internal engineers, tool suppliers, and research organizations to establish and introduce new wafer-level manufacturing techniques.

Qualifications

  • A formal qualification in Physics, Chemistry, Electrical Engineering, Semiconductor Science, or Microsystems Technology, with a strong preference for an Ausbildung (Vocational Training), technical certification, or Associate Degree in Microelectronics, Semiconductor Manufacturing, or Electronics.
  • 3+ years’ in frontend wafer processing, ideally within a production fab specializing in photonics, optical devices, or MEMS applications.
  • Strong practical understanding of semiconductor manufacturing methodologies, with specialized proficiency in module loops such as dry/wet etching, laser direct writing, PECVD, and wet bench procedures.
  • Exceptional manual dexterity, high meticulousness, strong analytical problem-solving skills, and an unwavering commitment to standard operating procedures (SOPs) and safety guidelines.
  • A proactive team player possessing a resilient work ethic, intercultural sensitivity, and the willingness to go above and beyond within a diverse international setting.
  • Professional fluency in spoken and written English; proficiency in German or Chinese represents a distinct advantage.
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